{"title":"三维集成TSV液冷的实验表征","authors":"Manseok Park, Sungdong Kim, S. Kim","doi":"10.1109/IITC-MAM.2015.7325660","DOIUrl":null,"url":null,"abstract":"The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"1 1","pages":"241-244"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Experimental characterization of TSV liquid cooling for 3D integration\",\"authors\":\"Manseok Park, Sungdong Kim, S. Kim\",\"doi\":\"10.1109/IITC-MAM.2015.7325660\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.\",\"PeriodicalId\":6514,\"journal\":{\"name\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"volume\":\"1 1\",\"pages\":\"241-244\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC-MAM.2015.7325660\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325660","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental characterization of TSV liquid cooling for 3D integration
The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.
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