低功耗23-GHz和27-GHz分布式级联放大器在标准的130nm SOI CMOS工艺

C. Pavageau, A. Siligaris, L. Picheta, F. Danneville, M. Si Moussa, J. Raskin, D. Vanhoenaker-Janvier, J. Russat, N. Fel
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引用次数: 7

摘要

采用标准的130 nm部分耗尽绝缘体上硅CMOS工艺设计了两个完全集成的分布式放大器(DA)。它们利用体接触(BC)或浮体(FB) mosfet和微带线。BC-DA的增益为5.4 dB,单位增益带宽为23 GHz,而FB-DA的增益为6.8 dB,单位增益带宽为27 GHz。在5ghz频率下,测量到的1db压缩输出功率为5dbm,在6- 18ghz频率下,噪声系数为6.5-7.5 dB。1.4 V时的功耗为58 mW。
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Low power 23-GHz and 27-GHz distributed cascode amplifiers in a standard 130nm SOI CMOS process
Two fully integrated distributed amplifiers (DA) were designed using a standard 130 nm partially-depleted silicon-on-insulator CMOS process. They make use of either body-contacted (BC) or floating-body (FB) MOSFETs, and microstrip lines. The BC-DA has a 5.4 dB gain and a unity-gain bandwidth of 23 GHz whereas the FB-DA has a 6.8 dB gain and a unity-gain bandwidth of 27 GHz. The measured output power at 1 dB compression is 5 dBm at 5 GHz and the noise figure is 6.5-7.5 dB over 6-18 GHz for both DAs. Power consumption is 58 mW at 1.4 V.
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