基于太赫兹技术的指纹传感器成型厚度无损测量

Longhai Liu, Haitao Jiang, Ying Wang, Qinghua Shou, Jianhua Xie, Yaqi Lu
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引用次数: 0

摘要

指纹传感器(FPS)由于体积小、安全性高而迅速普及。电容式FPS的成型厚度将影响其性能,需要对其进行精确的测量和控制。与切割和激光打孔法不同,介绍了一种利用太赫兹电磁波进行非破坏性切割的方法。太赫兹波可以穿透到成型封装材料中。成型厚度可以通过两个脉冲太赫兹波的时间延迟来测量。测量厚度与显微镜观察结果相关,结果在±4um间隙内。
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Finger print sensor molding thickness none destructive measurement with Terahertz technology
Fingerprint sensor (FPS) becomes rapidly popular due to small size and high safety. The molding thickness of capacitive FPS will affect its performance and needs to be accurately measured and controlled. Different from cutting and laser drilling method, one none destructive method with Terahertz electromagnetic wave is introduced. Terahertz wave can penetrate into the molding package materials. The molding thickness can be measured through time delay of two pulse Terahertz waves. The measured thickness is correlated with microscope view and the result is within ±4um gap.
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