谁在穿我的衣服?受限个人设备中基于tinydl的用户识别

IF 1.1 4区 计算机科学 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IET Computers and Digital Techniques Pub Date : 2021-10-21 DOI:10.1049/cdt2.12035
Ramon Sanchez-Iborra, Antonio Skarmeta
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引用次数: 1

摘要

深度学习(DL)技术已被广泛研究,以提高其在广泛应用中的精度和可扩展性。最近,TinyDL范式的出现推动了一个新的里程碑,它使知名库生成的复杂DL模型能够适应基于受限微控制器的设备的限制。在这项工作中,通过确定它将给可穿戴行业带来的好处,并分析科技巨头推动的不同TinyDL计划,对这种新型生态系统进行了全面的讨论。本文还介绍了从可穿戴设备捕获的数据中自动识别用户的具体用例。描述了整个开发过程,其中不同的DL配置已嵌入到实际的微控制器单元中。在准确性和资源使用方面获得的结果证实了该建议的有效性,该建议允许在输入信息有限的高度受限的平台上进行精确预测。因此,这项工作提供了对可穿戴设备中TinyDL模型集成可行性的见解,这可能对与该行业相关的研究人员,从业者和制造商有价值。
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Who is wearing me? TinyDL-based user recognition in constrained personal devices

Deep learning (DL) techniques have been extensively studied to improve their precision and scalability in a vast range of applications. Recently, a new milestone has been reached driven by the emergence of the TinyDL paradigm, which enables adaptation of complex DL models generated by well-known libraries to the restrictions of constrained microcontroller-based devices. In this work, a comprehensive discussion is provided regarding this novel ecosystem, by identifying the benefits that it will bring to the wearable industry and analysing different TinyDL initiatives promoted by tech giants. The specific use case of automatic user recognition from data captured by a wearable device is also presented. The whole development process by which different DL configurations have been embedded in a real microcontroller unit is described. The attained results in terms of accuracy and resource usage confirm the validity of the proposal, which allows precise predictions in a highly constrained platform with limited input information. Therefore, this work provides insights into the viability of the integration of TinyDL models within wearables, which may be valuable for researchers, practitioners, and makers related to this industry.

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来源期刊
IET Computers and Digital Techniques
IET Computers and Digital Techniques 工程技术-计算机:理论方法
CiteScore
3.50
自引率
0.00%
发文量
12
审稿时长
>12 weeks
期刊介绍: IET Computers & Digital Techniques publishes technical papers describing recent research and development work in all aspects of digital system-on-chip design and test of electronic and embedded systems, including the development of design automation tools (methodologies, algorithms and architectures). Papers based on the problems associated with the scaling down of CMOS technology are particularly welcome. It is aimed at researchers, engineers and educators in the fields of computer and digital systems design and test. The key subject areas of interest are: Design Methods and Tools: CAD/EDA tools, hardware description languages, high-level and architectural synthesis, hardware/software co-design, platform-based design, 3D stacking and circuit design, system on-chip architectures and IP cores, embedded systems, logic synthesis, low-power design and power optimisation. Simulation, Test and Validation: electrical and timing simulation, simulation based verification, hardware/software co-simulation and validation, mixed-domain technology modelling and simulation, post-silicon validation, power analysis and estimation, interconnect modelling and signal integrity analysis, hardware trust and security, design-for-testability, embedded core testing, system-on-chip testing, on-line testing, automatic test generation and delay testing, low-power testing, reliability, fault modelling and fault tolerance. Processor and System Architectures: many-core systems, general-purpose and application specific processors, computational arithmetic for DSP applications, arithmetic and logic units, cache memories, memory management, co-processors and accelerators, systems and networks on chip, embedded cores, platforms, multiprocessors, distributed systems, communication protocols and low-power issues. Configurable Computing: embedded cores, FPGAs, rapid prototyping, adaptive computing, evolvable and statically and dynamically reconfigurable and reprogrammable systems, reconfigurable hardware. Design for variability, power and aging: design methods for variability, power and aging aware design, memories, FPGAs, IP components, 3D stacking, energy harvesting. Case Studies: emerging applications, applications in industrial designs, and design frameworks.
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