微通道出口反向阶跃流动仿真及安培检测芯片优化设计

Xiaowei Liu, He Zhang, Xiaowei Han, Lin Zhao
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引用次数: 1

摘要

本文讨论了微通道出口处阶梯式结构引起的涡流。当边界层厚度和通道高度一定时,旋涡面积长度由雷诺数决定。为了更好地理解复合结构微流控电流检测芯片的雷诺数和涡流区长度,基于湍流模型进行了COMSOL多物理场仿真。根据仿真结果,讨论了微通道高度和辅助键合层厚度的取值,确定了微流控芯片的制造参数和装配工艺。并通过对微流控特性的模拟分析,阐述了如何设置安培检测的实验条件。
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Simulation of backward facing step flow at the outlet of micro-channel and optimal design of amperometric detection chip
In this paper, we discussed the vortex which cause by the step structure at the outlet of microchannel. When the the thickness of boundary layer and the height of the channel are fixed value, the vortex area length was decided by Reynolds number. COMSOL Multiphysics simulations based on the turbulence model were performed to provide a better understanding of the Reynolds number and the length of vortex area in the compound structure microfluidic amperometric detection chip. According to the simulation results, we discussed the value for the height of the microchannel and the thickness of auxiliary bonding layer, we determined the manufacture parameters and assembly process of the microfluidic chip. Furthermore through the simulation results discussion of the microfluidic properties, we described how to set experiment conditions for amperometric detection.
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