一种用于光互连的300mm硅光子平台

T. Mogami, T. Horikawa, K. Kinoshita, H. Sasaki, K. Morito, K. Kurata
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引用次数: 4

摘要

建立了用于300mm SOI晶圆的硅光子学平台,实现了多种光学应用。主要的光学器件已经演示。在该平台上获得了多厚度SOI结构光波导的最新传播损耗值。在1.55pm波长下,220nm厚波导的传输损耗小于0.5 dB/cm。MMI耦合器、AWG和WDM滤波器表现出足够高的应用性能。利用光电子会聚技术制备了50×50mm2大型硅中间体。这些结果表明我们的硅光子学平台在光学多用途应用中是非常有用的。
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A 300mm Si photonics platform for optical interconnection
The Si photonics platform for 300mm SOI wafers has been built up for optical multi-applications. Main optical devices have been demonstrated. State-of-the-art propagation loss values are obtained for optical waveguides of multi-thickness SOI structures in this platform. The propagation loss is less than 0.5 dB/cm at 1.55pm wavelength for 220nm-thick waveguides. MMI coupler, AWG and WDM filter showed enough high performance for their applications. The 50×50mm2 large Si interposers using photonics electronics convergence technology have been demonstrated. These results indicate that our Si photonics platform is very useful for optical multi-applications.
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