FlexTrateTM的流程集成

2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI:10.1109/IFETC.2018.8584029

T. Fukushima, Y. Susumago, H. Kino, Tetsu Tanaka, A. Alam, A. Hanna, S. Iyer

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引用次数: 1

摘要

FlexTrateTM是一种高度集成的可弯曲和/或可卷曲电子系统，其中各种Si和/或III-V芯片嵌入弹性体并在晶圆级互连。本文描述了FlexTrateTM的工艺集成，采用大规模平行毛细管自组装和新的单应力缓冲层技术，在嵌入的相邻芯片之间形成细间距互连，并表征了电气/机械性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Process Integration for FlexTrateTM

We fabricate FlexTrateTM that is highly integrated bendable and/or rollable electronic systems in which various Si and/or III–V chips are embedded in elastomers and interconnected at the wafer level. This paper describes the process integration of the FlexTrateTM using massively parallel capillary self-assembly and a new single stress buffer layer technologies to form fine-pitch interconnection between the embedded neighboring chips and characterize the electrical/mechanical properties.

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2018 International Flexible Electronics Technology Conference (IFETC)

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