使用冷却剂液体施加的热步骤测量电介质中空间电荷的温度测量

A. Oukms, P. Notingher, S. Agnel, A. Giani, P. Combette, C. Rodiet, S. Hegde
{"title":"使用冷却剂液体施加的热步骤测量电介质中空间电荷的温度测量","authors":"A. Oukms, P. Notingher, S. Agnel, A. Giani, P. Combette, C. Rodiet, S. Hegde","doi":"10.1109/ICD46958.2020.9341835","DOIUrl":null,"url":null,"abstract":"Improvements in space charge measurements by thermal methods can be acquired via the thorough knowledge of the temperature distribution at the surface and across the samples. The present work addresses surface temperature measurements for the Thermal Step Method (TSM) with a flat, thin thermo-resistive sensing structure. A structure containing a sensitive part made of a 150 nm platinum film, sputtered on a $400 \\mu m$ silicon wafer and covered by a 100 nm $Si_{3}N_{4}$ layer, has been manufactured and studied. Through data obtained by modelling and experimentally, it is shown that thermal temporal resolutions in the $\\mu s$ range can be obtained with the proposed device. The analysis is extended toward sensors made directly on polymeric substrates. Such setups will help to better estimate space charge distributions in relatively thick samples.","PeriodicalId":6795,"journal":{"name":"2020 IEEE 3rd International Conference on Dielectrics (ICD)","volume":"104 1","pages":"405-408"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Temperature Measurements for Space Charge Measurements in Dielectrics using a Thermal Step applied by a Coolant Liquid\",\"authors\":\"A. Oukms, P. Notingher, S. Agnel, A. Giani, P. Combette, C. Rodiet, S. Hegde\",\"doi\":\"10.1109/ICD46958.2020.9341835\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Improvements in space charge measurements by thermal methods can be acquired via the thorough knowledge of the temperature distribution at the surface and across the samples. The present work addresses surface temperature measurements for the Thermal Step Method (TSM) with a flat, thin thermo-resistive sensing structure. A structure containing a sensitive part made of a 150 nm platinum film, sputtered on a $400 \\\\mu m$ silicon wafer and covered by a 100 nm $Si_{3}N_{4}$ layer, has been manufactured and studied. Through data obtained by modelling and experimentally, it is shown that thermal temporal resolutions in the $\\\\mu s$ range can be obtained with the proposed device. The analysis is extended toward sensors made directly on polymeric substrates. Such setups will help to better estimate space charge distributions in relatively thick samples.\",\"PeriodicalId\":6795,\"journal\":{\"name\":\"2020 IEEE 3rd International Conference on Dielectrics (ICD)\",\"volume\":\"104 1\",\"pages\":\"405-408\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-07-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 3rd International Conference on Dielectrics (ICD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICD46958.2020.9341835\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 3rd International Conference on Dielectrics (ICD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICD46958.2020.9341835","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

通过对样品表面和样品间温度分布的全面了解,可以获得热法测量空间电荷的改进。目前的工作解决了热步法(TSM)的表面温度测量与一个扁平的,薄的热阻传感结构。本文制备和研究了一种结构,该结构包含一个由150 nm铂薄膜制成的敏感部件,溅射在400 \ μ m$硅晶片上,并覆盖100 nm $Si_{3}N_{4}$层。通过模拟和实验得到的数据表明,该装置可以获得$\ μ s$范围内的热时间分辨率。该分析扩展到直接在聚合物衬底上制造的传感器。这样的设置将有助于更好地估计相对较厚样品中的空间电荷分布。
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Temperature Measurements for Space Charge Measurements in Dielectrics using a Thermal Step applied by a Coolant Liquid
Improvements in space charge measurements by thermal methods can be acquired via the thorough knowledge of the temperature distribution at the surface and across the samples. The present work addresses surface temperature measurements for the Thermal Step Method (TSM) with a flat, thin thermo-resistive sensing structure. A structure containing a sensitive part made of a 150 nm platinum film, sputtered on a $400 \mu m$ silicon wafer and covered by a 100 nm $Si_{3}N_{4}$ layer, has been manufactured and studied. Through data obtained by modelling and experimentally, it is shown that thermal temporal resolutions in the $\mu s$ range can be obtained with the proposed device. The analysis is extended toward sensors made directly on polymeric substrates. Such setups will help to better estimate space charge distributions in relatively thick samples.
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