多孔热线二硫化钼薄膜的气敏研究

G. Papadimitropoulos, Angelika Balliou, Dimitris Kouvatsos, D. Davazoglou
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引用次数: 0

摘要

测试结构示意图如下图所示。在硅(100)晶片上沉积了厚度为100 nm的热氧化硅薄膜。在后者上,采用电子束蒸发和起飞技术对金交叉电极进行了图案化。电流的可逆变化是由氢(h2)和一氧化碳(CO)等化学气体的存在或去除引起的。
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Gas Sensing Investigation of Porous Hot-wire Molybdenum Disulphide Thin Films
Graphical abstract The schematic of the testing structure is shown in the following picture. The hwMoS 2 thin films were deposited on Si (100) wafers covered by a 100 nm thick thermal silicon oxide. Over the latter, gold interdigitated electrodes were patterned using ebeam evaporation and the lift-off technique. Reversible changes of current were caused by the presence or upon removal of chemical gases such as hydrogen (H 2 ) and carbon monoxide (CO).
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