Amdahl的优点图,SiGe HBT BiCMOS和3D芯片堆叠

P. Jacob, A. Zia, Okan Erdogan, P. Belemjian, Peng Jin, Jin Woo Kim, M. Chu, R. Kraft, J. McDonald
{"title":"Amdahl的优点图,SiGe HBT BiCMOS和3D芯片堆叠","authors":"P. Jacob, A. Zia, Okan Erdogan, P. Belemjian, Peng Jin, Jin Woo Kim, M. Chu, R. Kraft, J. McDonald","doi":"10.1109/ICCD.2007.4601901","DOIUrl":null,"url":null,"abstract":"Forty years ago Gene Amdahl published a figure of merit for parallel computation, which proved extremely controversial. The controversy still rages today, although those that have looked closely at this figure of merit conclude that it is correct, but perhaps misinterpreted. In this paper we will look at a small variation on that law that suggests computer designers should take a closer look at two emerging technologies, SiGe HBT BiCMOS and 3D chip stacking. We may be overlooking a way to continue the clock race, and in so doing accomplish better parallelism.","PeriodicalId":6306,"journal":{"name":"2007 25th International Conference on Computer Design","volume":"330 1","pages":"202-207"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Amdahl’s figure of merit, SiGe HBT BiCMOS, and 3D chip stacking\",\"authors\":\"P. Jacob, A. Zia, Okan Erdogan, P. Belemjian, Peng Jin, Jin Woo Kim, M. Chu, R. Kraft, J. McDonald\",\"doi\":\"10.1109/ICCD.2007.4601901\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Forty years ago Gene Amdahl published a figure of merit for parallel computation, which proved extremely controversial. The controversy still rages today, although those that have looked closely at this figure of merit conclude that it is correct, but perhaps misinterpreted. In this paper we will look at a small variation on that law that suggests computer designers should take a closer look at two emerging technologies, SiGe HBT BiCMOS and 3D chip stacking. We may be overlooking a way to continue the clock race, and in so doing accomplish better parallelism.\",\"PeriodicalId\":6306,\"journal\":{\"name\":\"2007 25th International Conference on Computer Design\",\"volume\":\"330 1\",\"pages\":\"202-207\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 25th International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2007.4601901\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 25th International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2007.4601901","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

四十年前,吉恩·阿姆达尔发表了一个并行计算的优点图,结果引起了极大的争议。尽管那些仔细研究过这一价值数字的人得出结论认为这是正确的,但可能被误解了,但争论至今仍在激烈进行。在本文中,我们将研究该定律的一个小变化,该定律建议计算机设计师应该仔细研究两种新兴技术,SiGe HBT BiCMOS和3D芯片堆叠。我们可能忽略了一种继续时钟竞赛的方法,这样做可以实现更好的并行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Amdahl’s figure of merit, SiGe HBT BiCMOS, and 3D chip stacking
Forty years ago Gene Amdahl published a figure of merit for parallel computation, which proved extremely controversial. The controversy still rages today, although those that have looked closely at this figure of merit conclude that it is correct, but perhaps misinterpreted. In this paper we will look at a small variation on that law that suggests computer designers should take a closer look at two emerging technologies, SiGe HBT BiCMOS and 3D chip stacking. We may be overlooking a way to continue the clock race, and in so doing accomplish better parallelism.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Compiler-assisted architectural support for program code integrity monitoring in application-specific instruction set processors Improving the reliability of on-chip data caches under process variations Analytical thermal placement for VLSI lifetime improvement and minimum performance variation Why we need statistical static timing analysis Voltage drop reduction for on-chip power delivery considering leakage current variations
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1