300ghz宽带功率放大器,增益带宽积508ghz,输出功率8dbm

B. Schoch, A. Tessmann, A. Leuther, S. Wagner, I. Kallfass
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引用次数: 16

摘要

本文提出了一种基于35 nm ingaas的变质高电子迁移率晶体管技术的宽带h波段(220 -325 GHz)功率放大器。该放大器采用亚毫米波单片集成电路(S-MMIC)实现,用于驱动多千兆通信系统中的高功率放大器。实现了基于共源增益单元的5级S-MMIC放大器,并对其进行了片上测量,285ghz时最大增益为23db。低截止频率和高截止频率分别为278 GHz和335 GHz,增益变化约为4 dB。放大器在最后两级有四个并联晶体管,在300 GHz时提供8 dBm的饱和输出功率。可以实现508 GHz的增益带宽积(GBW)。
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300 GHz broadband power amplifier with 508 GHz gain-bandwidth product and 8 dBm output power
This paper presents a broadband H-band (220 -325 GHz) power amplifier in a 35 nm InGaAs-based metamorphic high electron mobility transistor technology. The amplifier is realized as a submillimeter-wave monolithic integrated circuit (S-MMIC) and is designed to drive a high power amplifier in a multi-gigabit communication system. The five-stage amplifier S-MMIC based on common-source gain cells was realized and measured on-wafer with a maximum gain of 23 dB at 285 GHz. The lower and higher cutoff frequency is 278 and 335 GHz, respectively, with a gain variation of around 4 dB. The amplifier has four parallel transistors in the last two stages and provides a saturated output power of 8 dBm at 300 GHz. A gain-bandwidth product (GBW) of 508 GHz could be achieved.
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