硅衬底蚀刻掩模上锡包覆多壁碳纳米管界面纳米互连的形态表征

M. Us, Li-Jie Ci, Lin Kl
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引用次数: 0

摘要

第一阶段在碳纳米管悬浮液中沉淀SnCl2,合成了锡包覆多壁碳纳米管(SnO2/MWCNT)复合材料。采用三氟乙酸(TFA)在硅片蚀刻掩模上均匀分散锡包覆的多壁碳纳米管(MWCNT)。通过高分辨率透射电子能谱(HRTEM), MWCNT悬浮液均匀地分散在图像化硅片上,并清晰地建立了纳米互连或纳米接头的形成。高分辨率透射电镜(HRTEM)图像表明,两种MWCNTs之间形成的纳米互连既包括四方相Sn,也包括正交相SnO2。在回流气氛下,通过还原SnO2/MWCNTs,在两种多壁碳纳米管的界面上观察到单质Sn。研究了碳纳米管中石墨烯层与金属锡/氧化物的界面相互作用。拉曼光谱研究建立了MWCNT与金属锡之间的界面相互作用。结果表明,MWCNTs与Sn之间的强相互作用降低了MWCNTs中的ID/IG比。发现多壁碳纳米管在图案掩膜上相互连接良好,这一现象可以为电子电路中碳纳米管的导电性提供新的思路。
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Morphological Characterization of Nanointerconnects Formed at the Interface of Sn Coated Multiwalled Carbon Nanotubes on an Etching Mask Patterned on a Si Substrate
Tin-coated multiwalled carbon nanotube (SnO2/MWCNT) composites were synthesized by precipitation of SnCl2 within a CNT suspension in the first stage. An efficient dispersion technique using trifluroacetic acid (TFA) has been employed for the homogenous dispersion of Sn coated multiwalled carbon nanotubes (MWCNT) on an etching mask patterned on Si wafer using AZ 1500 as a photoresist. The MWCNT suspension was dispersed homogenously on the patterned Si wafer and the formation of nano-interconnects or nanojoints were clearly established by high-resolution transmission electron spectroscopy (HRTEM). High Resolution Transmission Electron Microscopy (HRTEM) images demonstrated that nano-interconnects formed between two MWCNTs consisted of both tetragonal Sn and orthorhombic SnO2 phase. .Elemental Sn was observed at the interface of two multiwalled carbon nanotubes by reduction of SnO2/MWCNTs under a reflow atmosphere. The interfacial interaction between the graphene layers in the carbon nanotubes and metallic Sn/oxides were also investigated. Raman spectroscopy studies established the interfacial interaction between MWCNT and the metallic Sn. The results revealed that the strong interaction between MWCNT and Sn lowered the ID/IG ratio in MWCNTs. The multiwalled carbon nanotubes were found to be well connected to each other on the patterned mask and this phenomenon could throw new light on the conductivity of carbon nanotubes in electronic circuits.
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