G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano
{"title":"Ka波段正交换能器的3D打印","authors":"G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano","doi":"10.1109/IMWS-AMP.2018.8457143","DOIUrl":null,"url":null,"abstract":"In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.","PeriodicalId":6605,"journal":{"name":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","volume":"36 1 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"3D Printing of Ka band Orthomode Transducers\",\"authors\":\"G. Addamo, O. Peverini, G. Virone, F. Paonessa, D. Manfredi, F. Calignano\",\"doi\":\"10.1109/IMWS-AMP.2018.8457143\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.\",\"PeriodicalId\":6605,\"journal\":{\"name\":\"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)\",\"volume\":\"36 1 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMWS-AMP.2018.8457143\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMWS-AMP.2018.8457143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this paper, the advance of an on-going research activity jointly developed by CNR-IEIIT, IIT and Politecnico di Torino in the design and SLM manufacturing of high performances microwave devices is reported. In particular, two prototypes of Ka-band Orthomode Transducers, based on a novel AM-oriented layout, are presented. All the component building blocks, such as, coupling junction, bends and twists are integrated in a single mechanical part suitable for 3D printing.
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