{"title":"CMP浆料计量满足行业需求","authors":"R. Mavliev","doi":"10.1109/CSTIC.2017.7919821","DOIUrl":null,"url":null,"abstract":"Slurry is one of most critical yield defining components of CMP process and potential source of problems. Timely and proper monitoring of slurry parameters is critical for CMP yield improvement. Slurry is very complex system - the combination of chemistry and nanoparticles with wide range of parameters. Metrology of slurry parameters could be done in 3 levels- supplier manufacturing/delivery site, Slurry Delivery Systems (SDS) in subfab and point-of-use (POU) - CMP tool, with very different time requirements, size and concentration limits on each level.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"35 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"CMP slurry metrology to meet the industry demand\",\"authors\":\"R. Mavliev\",\"doi\":\"10.1109/CSTIC.2017.7919821\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Slurry is one of most critical yield defining components of CMP process and potential source of problems. Timely and proper monitoring of slurry parameters is critical for CMP yield improvement. Slurry is very complex system - the combination of chemistry and nanoparticles with wide range of parameters. Metrology of slurry parameters could be done in 3 levels- supplier manufacturing/delivery site, Slurry Delivery Systems (SDS) in subfab and point-of-use (POU) - CMP tool, with very different time requirements, size and concentration limits on each level.\",\"PeriodicalId\":6846,\"journal\":{\"name\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"35 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2017.7919821\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Slurry is one of most critical yield defining components of CMP process and potential source of problems. Timely and proper monitoring of slurry parameters is critical for CMP yield improvement. Slurry is very complex system - the combination of chemistry and nanoparticles with wide range of parameters. Metrology of slurry parameters could be done in 3 levels- supplier manufacturing/delivery site, Slurry Delivery Systems (SDS) in subfab and point-of-use (POU) - CMP tool, with very different time requirements, size and concentration limits on each level.
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