光伏应用中的水凝胶介导半导体键合

Kodai Kishibe, K. Tanabe
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引用次数: 0

摘要

水凝胶介导的半导体晶圆键合已被证明可以低成本制造高效率的晶格不匹配多结太阳能电池。当晶圆表面有粗糙或颗粒时,晶圆直接键合很难应用。我们的水凝胶粘合方案得益于高表面粗糙度和颗粒容差、光学透射率和导电性,利用了水凝胶的多用途特性,特别适合光伏应用。我们研究了三种类型的水凝胶,它们都具有足够的透光率,结合强度和导电性,用于制造高效的多结太阳能电池。
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Hydrogel-Mediated Semiconductor Bonding for Photovoltaic Applications
Hydrogel-mediated semiconductor wafer bonding has been demonstrated for low-cost fabrication of high-efficiency lattice-mismatched multijunction solar cells. Wafer direct bonding can be hardly applied in the presence of wafer surface roughness or particles. Our hydrogel bonding scheme benefits from high surface roughness and particulate tolerances, optical transmittance, and electrical conductivity by utilizing the hydrogels' versatile properties suitable particularly for photovoltaic applications. We have investigated three types of hydrogels and all of them exhibit sufficient transmittance, bonding strength, and conductivity for the fabrication of highefficiency multijunction solar cells.
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