{"title":"基于电热驱动的SU-8微夹持器新设计","authors":"R. Voicu, R. Muller, L. Eftime","doi":"10.1109/SMICND.2008.4703369","DOIUrl":null,"url":null,"abstract":"A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.","PeriodicalId":6406,"journal":{"name":"2008 IEEE International Conference on Semiconductor Electronics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A new design based on electro-thermally actuation for an SU-8 microgripper\",\"authors\":\"R. Voicu, R. Muller, L. Eftime\",\"doi\":\"10.1109/SMICND.2008.4703369\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.\",\"PeriodicalId\":6406,\"journal\":{\"name\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2008.4703369\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2008.4703369","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new design based on electro-thermally actuation for an SU-8 microgripper
A new design for a polymeric microgripper was developed. Two microgripper with different dimensions were considered. An evaluation between these models was performed using the simulation results. Finite-element analyses of the microgripper, using COVENTORWARE, are performed in order to evaluate the relation between the displacement, temperatures and the electrical current passing through the metallic layers.
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