新型平面电容(PCAP)车辆的演示,以评估电介质和金属阻隔薄膜

Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo
{"title":"新型平面电容(PCAP)车辆的演示,以评估电介质和金属阻隔薄膜","authors":"Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo","doi":"10.1109/IITC-MAM.2015.7325646","DOIUrl":null,"url":null,"abstract":"Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"80 1","pages":"139-142"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films\",\"authors\":\"Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo\",\"doi\":\"10.1109/IITC-MAM.2015.7325646\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.\",\"PeriodicalId\":6514,\"journal\":{\"name\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"volume\":\"80 1\",\"pages\":\"139-142\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC-MAM.2015.7325646\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

平面电容器可以快速测试金属和电介质的材料性能。一种侧壁电容器装置用于评价金属薄膜屏障。蚀刻停止平面电容器反过来可以测试多层蚀刻停止,暴露泄漏和良好的蚀刻停止膜之间的差异。还制备了可填充的平面电容器,并给出了该类填充材料的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films
Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
High-voltage monolithic 3D capacitors based on through-silicon-via technology Wafer level metallic bonding: Voiding mechanisms in copper layers A flexible top metal structure to improve ultra low-k reliability Nanostructured material formation for beyond Si devices Ni silicides formation: Use of Ge and Pt to study the diffusing species, lateral growth and relaxation mechanisms
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1