用于扩展后硅调试的应用级硬件跟踪

D. Pal, Abhishek Sharma, S. Ray, F. M. D. Paula, Shobha Vasudevan
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引用次数: 4

摘要

我们提出了一种选择跟踪消息的方法,用于具有不同使用场景的片上系统(soc)的硅后验证。我们对典型应用程序中交互流的规范进行建模。我们的方法优化了跟踪缓冲区利用率和流规范覆盖率。本文介绍了工业规模OpenSPARC T2处理器中细微错误的调试和根本原因分析。我们证明了这种规模超出了当前跟踪方法的能力。我们实现了98.96%的跟踪缓冲区利用率,流规范覆盖率为94.3%(平均)。在大规模调试工作中,我们将bug定位为21.11%(平均)的潜在根本原因。
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Application Level Hardware Tracing for Scaling Post-Silicon Debug
We present a method for selecting trace messages for post-silicon validation of Systems-on-a-Chips (SoCs) with diverse usage scenarios. We model specifications of interacting flows in typical applications. Our method optimizes trace buffer utilization and flow specification coverage. We present debugging and root cause analysis of subtle bugs in the industry scale OpenSPARC T2 processor. We demonstrate that this scale is beyond the capacity of current tracing approaches. We achieve trace buffer utilization of 98.96% with a flow specification coverage of 94.3% (average). We localize bugs to 21.11% (average) of the potential root causes in our large-scale debugging effort.
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