{"title":"用于电子设备冷却的纳米级工程表面","authors":"P. Shandilya, A. Shaji, K. Sankaran","doi":"10.1063/1.5122483","DOIUrl":null,"url":null,"abstract":"Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...","PeriodicalId":7262,"journal":{"name":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","volume":"102 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Nanoscale engineered surfaces for cooling in electronic devices\",\"authors\":\"P. Shandilya, A. Shaji, K. Sankaran\",\"doi\":\"10.1063/1.5122483\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...\",\"PeriodicalId\":7262,\"journal\":{\"name\":\"ADVANCES IN BASIC SCIENCE (ICABS 2019)\",\"volume\":\"102 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ADVANCES IN BASIC SCIENCE (ICABS 2019)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1063/1.5122483\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ADVANCES IN BASIC SCIENCE (ICABS 2019)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/1.5122483","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nanoscale engineered surfaces for cooling in electronic devices
Nanoscale engineered surfaces can be used as cooling structures (heat sinks) in the integrated circuits. These advanced materials are studied for their performance compared to standard materials to...
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