利用玻璃回流工艺在玻璃基板上制备高Q值螺旋电感器的电学模拟与研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI:10.1109/ICEPT.2016.7583275

Hai-yang Chen, X. Jing, J. Shang

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引用次数: 2

摘要

为了满足无线通信系统的高集成度和低成本的要求，无源器件被广泛应用于各种系统中。介绍了一种基于玻璃回流工艺制造集成无源电感器的创新方法。采用三维电磁仿真软件HFSS(高频结构模拟器)对集成无源器件进行了仿真。从0GHz到10GHz, Q值在200以上，高于传统薄膜电感的Q值。此外，对螺旋电感的几个关键参数，包括电感直径、电感厚度、衬底厚度、电感宽度和电感空间进行了研究。最后介绍了电感器的制造工艺。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process

In order to meet the need of high integration and low cost of wireless communication systems, passive devices are widely used in all kinds of systems. This paper introduces an innovative method to manufacture integrated passive inductors based on glass reflow process. IPDs(integrated passive devices) have been simulated by 3D EM(electromagnetic) simulator software HFSS(high frequency structure simulator). From 0GHz to 10GHz, the Q value is above 200, higher than the Q value of conventional thin film inductors. Moreover, several key parameters of spiral inductors including inductor diameter, inductor thickness, substrate thickness, inductor width and inductor space are investigated. Finally, manufacturing process of inductors is presented.

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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