超临界流体沉积技术使金属涂层在3d打印聚合物上,用于制造高纵横比太赫兹器件

T. Momose, K. Konishi, Yu Zhao, H. Morishita, Tetsuya Tsuchida, Yuyuan Huang, Hiroyuki Yasukochi, Kentaro Soeda, M. Deura, Y. Shimoyama, J. Yumoto, M. Kuwata-Gonokami, Y. Shimogaki
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摘要

三维(3D)太赫兹器件由于特征尺寸较小和结构复杂,通常存在制造困难。本文提出了两种技术相结合的新型制备方法;使用高分辨率3D打印技术构建3D聚合物结构,然后使用高阶覆盖沉积技术超临界流体沉积(SCFD)在其表面涂覆金属膜。SCFD在聚合物上形成金属膜的困难是最大的障碍,但通过一种简单的表面改性技术在氧气环境中退火聚合物克服了这一困难。因此,我们演示了太赫兹高通滤波器的制作。我们开发的方法可以实现太赫兹器件所需组件的单片集成,例如无源组件和波导。它避免了单独组装组件导致潜在的信号损失,这是由于太赫兹波的频率增加而更加关键的不对准。
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Supercritical fluid deposition technique enabling metallic coating onto 3D-printed polymer for fabrication of high-aspect-ratio THz devices
Three-dimensional (3D) terahertz devices often have difficulty of fabrication due to smaller feature size and complexity of architecture. We herein propose the new fabrication method by combining two techniques; building 3D polymer architecture using high-resolution 3D printing, followed by coating its surface with metal film using high-step-coverage deposition technique, supercritical fluid deposition (SCFD). Difficulty of metal film formation by SCFD onto the polymer is the largest obstacle, but was overcome by a facile surface modification technique to anneal the polymer in oxygen ambient. We thereby demonstrated the fabrication of THz high-pass filter. Our developed method enables the monolithic integration of necessary components for THz devices, for instance passive components together with waveguides. It obviates assembly of individually fabricated components that leads to potential signal loss caused by misalignment, which is more critical with increasing frequency of THz waves.
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