{"title":"通过优化28nm Poly/SiON SoC技术的间隔层来改善MOSFET射频性能","authors":"Hai Liu, River He, Byunghak Lee","doi":"10.1109/CSTIC.2017.7919740","DOIUrl":null,"url":null,"abstract":"As the MOSFET scales down, with keeping increasing of speed (ft), minimum noise figure (NF) is difficult to scale down where increasing gate resistance (Rg) is one of crucial impact factors. In this paper, we present a novel approach to boost MOSFET RF performance by spacer profile optimization. It can help reduce Rg about 12% and increase Fmax about 7% for critical size device (L=27nm) without degrading device DC performance on 28nm Poly/SiON technology platform. This approach does NOT introduce any extra steps into process flow and can be easily combined with those traditional Rg reduction methods.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"9 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"MOSFET RF performance improvement through spacer profile optimization for 28nm Poly/SiON SoC technology\",\"authors\":\"Hai Liu, River He, Byunghak Lee\",\"doi\":\"10.1109/CSTIC.2017.7919740\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the MOSFET scales down, with keeping increasing of speed (ft), minimum noise figure (NF) is difficult to scale down where increasing gate resistance (Rg) is one of crucial impact factors. In this paper, we present a novel approach to boost MOSFET RF performance by spacer profile optimization. It can help reduce Rg about 12% and increase Fmax about 7% for critical size device (L=27nm) without degrading device DC performance on 28nm Poly/SiON technology platform. This approach does NOT introduce any extra steps into process flow and can be easily combined with those traditional Rg reduction methods.\",\"PeriodicalId\":6846,\"journal\":{\"name\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"9 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2017.7919740\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919740","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
MOSFET RF performance improvement through spacer profile optimization for 28nm Poly/SiON SoC technology
As the MOSFET scales down, with keeping increasing of speed (ft), minimum noise figure (NF) is difficult to scale down where increasing gate resistance (Rg) is one of crucial impact factors. In this paper, we present a novel approach to boost MOSFET RF performance by spacer profile optimization. It can help reduce Rg about 12% and increase Fmax about 7% for critical size device (L=27nm) without degrading device DC performance on 28nm Poly/SiON technology platform. This approach does NOT introduce any extra steps into process flow and can be easily combined with those traditional Rg reduction methods.