粘接接头设计与有限元分析综述

Neha B. Thakare, A. Dhumne
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引用次数: 7

摘要

设计轻量化结构的需要和轻量化材料在工业领域的使用增加,导致粘合剂的广泛使用。本文从粘接接头的静载荷分析、疲劳载荷分析和动态特性等方面综述了近年来粘接接头有限元分析的研究进展。在这项工作中,将使用Ms平板制作接缝。接头将通过焊接、铆接和胶粘接工艺制成。粘合剂将使用环氧树脂作为粘合剂材料制成。为了进行实验分析,将进行数值计算。计算分析将包括应力、屈曲和振动分析。实验分析结果将与计算分析相验证。
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A Review on Design and Analysis of Adhesive Bonded Joint by Finite Element Analysis
The need to design lightweight structures and the increased use of lightweight materials in industrial fields, have led to wide use of adhesive bonding. Recent work relating to finite element analysis of adhesively bonded joints is reviewed in this paper, in terms of static loading analysis, fatigue loading analysis and dynamic characteristics of the adhesively bonded joints. In this work fabrication of joint using Ms flat plate will be done. The joint will be made by welding, riveting and adhesive bonding process. Adhesive bond will be created by using epoxy as an adhesive material. The numerical calculation will be done for the experimental analysis. Computational analysis will be comprises of stress, buckling and vibrational analysis. Result of experimental analysis will be validating with computational analysis.
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