T. Nunnally, D. Pellicone, Nathan Van Velson, James Schmidt, T. Desai
{"title":"热电性能模型开发和验证的选择和设计工具","authors":"T. Nunnally, D. Pellicone, Nathan Van Velson, James Schmidt, T. Desai","doi":"10.1109/ITHERM.2014.6892444","DOIUrl":null,"url":null,"abstract":"A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were shown to be reduced by up to 15% with the addition of a thermoelectric cooler. Furthermore, in both scenarios, the model predicted the temperature of the cooled components within 3-10% accuracy. Further development of the model could result in a tool, which is not currently available, for optimizing system performance and determining the applicability of thermoelectric cooling in a given scenario.","PeriodicalId":12453,"journal":{"name":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"75 1","pages":"1404-1411"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Thermoelectric performance model development and validation for a selection and design tool\",\"authors\":\"T. Nunnally, D. Pellicone, Nathan Van Velson, James Schmidt, T. Desai\",\"doi\":\"10.1109/ITHERM.2014.6892444\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were shown to be reduced by up to 15% with the addition of a thermoelectric cooler. Furthermore, in both scenarios, the model predicted the temperature of the cooled components within 3-10% accuracy. Further development of the model could result in a tool, which is not currently available, for optimizing system performance and determining the applicability of thermoelectric cooling in a given scenario.\",\"PeriodicalId\":12453,\"journal\":{\"name\":\"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"75 1\",\"pages\":\"1404-1411\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2014.6892444\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2014.6892444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermoelectric performance model development and validation for a selection and design tool
A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were shown to be reduced by up to 15% with the addition of a thermoelectric cooler. Furthermore, in both scenarios, the model predicted the temperature of the cooled components within 3-10% accuracy. Further development of the model could result in a tool, which is not currently available, for optimizing system performance and determining the applicability of thermoelectric cooling in a given scenario.