N. Bertolino, J. Garay, Umberto Anselmi-Tamburini, Z. Munir
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引用次数: 31
摘要
在400-500°C的温度范围内,研究了高直流电流(高达1019 A cm−2)对薄Au-Al层相互作用的影响。与早期的扩散偶的结果相比,在没有电流和在所有水平上存在电流的情况下,该系统中只有四种金属间化合物被观察到。金属间化合物Au5 Al2和Au2 Al是主要产物,而AuAl和AuAl2相对不显著。后者的变化不大,仅增长到几微米的总厚度,无论电流密度的大小和退火时间。虽然不同金属间化合物的形成顺序不受电流的影响,但层的孵育时间和生长速度受到强烈影响。出现可测量产品层的孵化时间因电流而显著减少,在某些情况下减少了近两个数量级。通过使用“预成核”样品,研究了电流对产物相成核的影响。讨论了电流对原子通量(电迁移)和缺陷形成的影响,并与最近在多层体系中观察到的场效应进行了比较。
High-flux current effects in interfacial reactions in Au–Al multilayers
Abstract The influence of high dc currents (up to 1019 A cm−2) on the interaction between thin Au-Al layers was investigated over the temperature range 400-500°C. In contrast with earlier diffusion couple results, only four of the five intermetalllic compounds in this system were observed, in both the absence and the presence of a current at all levels. The intermetallics Au5 Al2 and Au2 Al were the dominant products while AuAl and AuAl2 were relatively insignificant. The latter showed little change, growing only to a total thickness of a few micrometres, regardless of the magnitude of the current density and time of annealing. While the sequence of formation of the different intermetallics was not affected by the current, the incubation time and rate of growth of the layers were strongly influenced. The incubation time for the appearance of a measurable product layer was markedly reduced by the current, by nearly two orders of magnitude in some cases. The effect of the current on the nucleation of the product phases was investigated through the use of ‘pre-nucleated’ samples. The results are discussed in light of the effect of the current on atomic flux (electromigration) and on the formation of defects and compared with recent observations on field effects in multilayer systems.