热时移:利用相变材料来降低仓库级计算机的冷却成本

Matt Skach, Manish Arora, Chang-Hong Hsu, Qi Li, D. Tullsen, Lingjia Tang, Jason Mars
{"title":"热时移:利用相变材料来降低仓库级计算机的冷却成本","authors":"Matt Skach, Manish Arora, Chang-Hong Hsu, Qi Li, D. Tullsen, Lingjia Tang, Jason Mars","doi":"10.1145/2749469.2749474","DOIUrl":null,"url":null,"abstract":"Datacenters, or warehouse scale computers, are rapidly increasing in size and power consumption. However, this growth comes at the cost of an increasing thermal load that must be removed to prevent overheating and server failure. In this paper, we propose to use phase changing materials (PCM) to shape the thermal load of a datacenter, absorbing and releasing heat when it is advantageous to do so. We present and validate a methodology to study the impact of PCM on a datacenter, and evaluate two important opportunities for cost savings. We find that in a datacenter with full cooling system subscription, PCM can reduce the necessary cooling system size by up to 12% without impacting peak throughput, or increase the number of servers by up to 14.6% without increasing the cooling load. In a thermally constrained setting, PCM can increase peak throughput up to 69% while delaying the onset of thermal limits by over 3 hours.","PeriodicalId":6878,"journal":{"name":"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)","volume":"44 1","pages":"439-449"},"PeriodicalIF":0.0000,"publicationDate":"2015-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"41","resultStr":"{\"title\":\"Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers\",\"authors\":\"Matt Skach, Manish Arora, Chang-Hong Hsu, Qi Li, D. Tullsen, Lingjia Tang, Jason Mars\",\"doi\":\"10.1145/2749469.2749474\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Datacenters, or warehouse scale computers, are rapidly increasing in size and power consumption. However, this growth comes at the cost of an increasing thermal load that must be removed to prevent overheating and server failure. In this paper, we propose to use phase changing materials (PCM) to shape the thermal load of a datacenter, absorbing and releasing heat when it is advantageous to do so. We present and validate a methodology to study the impact of PCM on a datacenter, and evaluate two important opportunities for cost savings. We find that in a datacenter with full cooling system subscription, PCM can reduce the necessary cooling system size by up to 12% without impacting peak throughput, or increase the number of servers by up to 14.6% without increasing the cooling load. In a thermally constrained setting, PCM can increase peak throughput up to 69% while delaying the onset of thermal limits by over 3 hours.\",\"PeriodicalId\":6878,\"journal\":{\"name\":\"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)\",\"volume\":\"44 1\",\"pages\":\"439-449\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"41\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2749469.2749474\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 ACM/IEEE 42nd Annual International Symposium on Computer Architecture (ISCA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2749469.2749474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 41

摘要

数据中心或仓库级计算机的规模和功耗正在迅速增加。然而,这种增长是以不断增加的热负载为代价的,必须消除热负载以防止过热和服务器故障。在本文中,我们建议使用相变材料(PCM)来塑造数据中心的热负荷,在有利的时候吸收和释放热量。我们提出并验证了一种方法来研究PCM对数据中心的影响,并评估了节省成本的两个重要机会。我们发现,在完全订购冷却系统的数据中心中,PCM可以在不影响峰值吞吐量的情况下将必要的冷却系统大小减少多达12%,或者在不增加冷却负载的情况下将服务器数量增加多达14.6%。在热受限的环境中,PCM可以将峰值吞吐量提高69%,同时将热限制的开始延迟3小时以上。
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Thermal time shifting: Leveraging phase change materials to reduce cooling costs in warehouse-scale computers
Datacenters, or warehouse scale computers, are rapidly increasing in size and power consumption. However, this growth comes at the cost of an increasing thermal load that must be removed to prevent overheating and server failure. In this paper, we propose to use phase changing materials (PCM) to shape the thermal load of a datacenter, absorbing and releasing heat when it is advantageous to do so. We present and validate a methodology to study the impact of PCM on a datacenter, and evaluate two important opportunities for cost savings. We find that in a datacenter with full cooling system subscription, PCM can reduce the necessary cooling system size by up to 12% without impacting peak throughput, or increase the number of servers by up to 14.6% without increasing the cooling load. In a thermally constrained setting, PCM can increase peak throughput up to 69% while delaying the onset of thermal limits by over 3 hours.
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