{"title":"一种测量膏体材料导热性的方法","authors":"W. Feng, Fanny Zhao, Brian Shieh, S. W. R. Lee","doi":"10.1109/ICEPT.2016.7583185","DOIUrl":null,"url":null,"abstract":"A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid samples was developed. Three types of paste materials were investigated. From detailed comparisons, it could be concluded that the accuracy of this method is more than 95%. Consequently, the proposed method was validated.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"45 1","pages":"510-513"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A method for measuring thermal conductivity of paste materials\",\"authors\":\"W. Feng, Fanny Zhao, Brian Shieh, S. W. R. Lee\",\"doi\":\"10.1109/ICEPT.2016.7583185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid samples was developed. Three types of paste materials were investigated. From detailed comparisons, it could be concluded that the accuracy of this method is more than 95%. Consequently, the proposed method was validated.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"45 1\",\"pages\":\"510-513\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A method for measuring thermal conductivity of paste materials
A novel method for the evaluation of thermal conductivity of paste materials is proposed in this paper. The principle is based on the measurement of the thermal conductivity of composite materials together with finite element modeling (FEM). In the present study, the FEM based on the structure and working principle of an apparatus (THISYS) used for measuring the thermal conductivity of thin and solid samples was developed. Three types of paste materials were investigated. From detailed comparisons, it could be concluded that the accuracy of this method is more than 95%. Consequently, the proposed method was validated.
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