未来SoC设计挑战与解决方案

C. C. Chen, Ed Cheng
{"title":"未来SoC设计挑战与解决方案","authors":"C. C. Chen, Ed Cheng","doi":"10.1109/ISQED.2002.996800","DOIUrl":null,"url":null,"abstract":"SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Future SoC design challenges and solutions\",\"authors\":\"C. C. Chen, Ed Cheng\",\"doi\":\"10.1109/ISQED.2002.996800\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.\",\"PeriodicalId\":20510,\"journal\":{\"name\":\"Proceedings International Symposium on Quality Electronic Design\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2002.996800\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2002.996800","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

摘要

SoC(片上系统)设计对传统的VLSI ASIC设计提出了巨大的设计挑战。它不仅涵盖了传统的DSM(深亚微米)问题,还包括集成问题,如IP和信号完整性,特别是对于集成数字/模拟系统,如蓝牙。除了。功耗和功率传输也对已经很困难的情况施加了巨大的设计限制,特别是对于便携式和移动设备。本讲座将介绍和分析潜在的SoC问题和潜在的解决方案,从架构层面到电路层面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Future SoC design challenges and solutions
SoC (system on a chip) design creates tremendous design challenges to the traditional VLSI ASIC design. It covers not only the traditional DSM (deep sub-micron) issues but also the integration issues such as IP and signal integrity especially for integrated digital/analog system such as Bluetooth. Besides. power consumption and power delivery also impose huge design constraints to the already difficult situation especially for the portable and mobile devices. This talk will introduce and analysis the potential SoC issues and potential solutions from the architecture level to the circuit level.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
False-noise analysis using resolution method Trading off reliability and power-consumption in ultra-low power systems Fabrication technologies for three-dimensional integrated circuits Test generation and fault modeling for stress testing Noise injection and propagation in high performance designs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1