Cr底层溅射Co-Cu膜的成分依赖性形成

W. Rattanasakulthong, P. Sirisangsawang, S. Pinitsoontorn
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引用次数: 0

摘要

采用射频溅射法在Cr衬底上制备了x = 57.7、45.8、25.5、13.8、8.8、7.5和1.8的Co x Cu 100-x溅射膜。SEM结果表明,Co-Cu膜和Cr下层的平均厚度分别为92 nm和22nm。所有Co-Cu膜均由BCC-Cr(110)底层(111)方向的Co (FCC)相和Cu (FCC)相组成。Co-Cu膜的磁性能、表面粗糙度和形貌取决于膜的组成。Co 7.5 Cu 92.5和Co 45.8 Cu 54.2薄膜的表面粗糙度最大值分别为3.24 nm和1.16nm。可以认为,薄膜表面粗糙度的变化是由于Co和Cu原子在下层Cr上聚集速率的不同造成的。在室温下,Co 57.5 Cu 42.3、Co 45.8 Cu 54.2和Co 25.5 Cu 74.5为铁磁相,其余为顺磁相。随着Co含量的增加,Cr下层Co- cu膜的饱和磁化强度、剩余磁化强度和矫顽力场均略有增大。结果表明,通过调整Co-Cu膜的成分,可以达到所需的磁性能和表面粗糙度。
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Composition Dependent Formation of Sputtered Co-Cu Film on Cr Under-Layer
— Sputtered Co x Cu 100-x films with the different compositions of x = 57.7, 45.8, 25.5, 13.8, 8.8, 7.5 and 1.8 were deposited on Cr under-layer by RF-sputtering. SEM result reveals that the averaged thickness of Co-Cu film and Cr under-layer are 92 nm and 22nm, respectively. All Co-Cu films are composed of Co (FCC) and Cu (FCC) phases in (111) directions on BCC-Cr (110) under-layers. Magnetic properties, surface roughness and morphology of Co-Cu films are dependent on the film composition. The maximum and minimum surface roughness of 3.24 and 1.16nm are observed on the Co 7.5 Cu 92.5 and Co 45.8 Cu 54.2 films, respectively. It can be described that the variance of surface roughness of the film because of the difference of the agglomeration rate of Co and Cu atoms on Cr under-layer. The Co 57.5 Cu 42.3 , Co 45.8 Cu 54.2 and Co 25.5 Cu 74.5 films shows the ferromagnetic phase whereas the rest of the film exhibits the paramagnetic phase at room temperature. The saturation magnetization, remnant magnetization and coercive field of Co-Cu films on Cr under-layer are slightly increased with increasing the Co composition. It can be concluded that the required magnetic properties and surface roughness of the Co-Cu film can be adapted by the adjustment of the film composition.
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