Low temperature homoepitaxial growth of GaAs by dissociating trimethylgallium and trimethylarsenic in a remote hydrogen plasma

A downstream near afterglow plasma was used to deposit epitaxial GaAs at substrate temperatures as low as 300 °C. Feedstock organometallics of trimethylgallium and trimethylarsenic were employed at a ratio of 1:2, respectively. The observed growth rate varies with the substrate temperature, but no growth occurs without the plasma. Scanning electron microscopy electron backscattering was used to probe the single crystal quality of the deposited layers.