Heat is the Enemy of Energy Efficiency: a Novel Material for Thermal Management

Control over the flow of heat has been a major challenge to engineers for centuries. A modern day example is a data center, where cooling accounts for 50% of the total energy costs. At the structural scale, a dark colored roof will increase the air conditioning load. Inside the building, the metal enclosures of the servers will trap and re-radiate heat internally. At a semiconductor scale, the processing power of the chips themselves is limited by their ability to dissipate heat. A new nano-chemical, developed by TAG Technologies, can impede the flow of heat through materials in one direction only. This new material can be added to almost any product to control the flow of heat, save energy, and reduce greenhouse gas emissions. Examples are presented in this paper including data centers, cool roofs, consumer goods packaging, refrigerated shipping, automotive, high voltage electrical conductors, and semi-conductors.