采用低损耗低串扰聚降冰片烯波导的光电模块240 Gbps以上高带宽数据传输演示

Y. Ito, S. Terada, M. Singh, S. Arai, K. Choki
{"title":"采用低损耗低串扰聚降冰片烯波导的光电模块240 Gbps以上高带宽数据传输演示","authors":"Y. Ito, S. Terada, M. Singh, S. Arai, K. Choki","doi":"10.1109/ECTC.2012.6249038","DOIUrl":null,"url":null,"abstract":"We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.","PeriodicalId":6384,"journal":{"name":"2012 IEEE 62nd Electronic Components and Technology Conference","volume":"26 1","pages":"1526-1531"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides\",\"authors\":\"Y. Ito, S. Terada, M. Singh, S. Arai, K. Choki\",\"doi\":\"10.1109/ECTC.2012.6249038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.\",\"PeriodicalId\":6384,\"journal\":{\"name\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"volume\":\"26 1\",\"pages\":\"1526-1531\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 62nd Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2012.6249038\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 62nd Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2012.6249038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

摘要

我们开发了一种新颖的柔性光电(O/E)收发模块,设计用于板级互连的高带宽和低损耗数据传输。在O/E模块中,集成电路(ic)和两个12通道O/E器件(850 nm垂直腔面发射激光二极管(vcsel)和光电二极管(pd)被倒装在柔性印刷电路(FPC)上。O/E模块和24通道聚去甲冰片烯(PNB)波导片通过成本效益和标准封装工艺分别制备。在O/E模块制造过程的最后,PNB波导片通过键合片集成在完整的fpc与ic和O/E器件上。在PNB波导中形成的微镜分别被动对准O/E器件相应的有源区域。PNB波导片(120mm长)在O/E模块之间双向连接。我们成功地演示了使用具有低损耗和低串扰PNB波导的光链路O/E收发模块高达16 Gbps/信道的数据传输。
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Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides
We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.
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Parasitic electrical and electromagnetic effects Heat management Passive electronic components Interconnection technology Reliability and maintainability
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