SOI积累模式三栅极LDMOS的电热特性研究

Zhangjun Shi, Xiaojin Li, Yabin Sun, Yanling Shi
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引用次数: 0

摘要

通过TCAD仿真对绝缘体上硅(SOI)积累模式三栅极(ATG) LDMOS进行了电热协同优化。研究了SOI-ATG LDMOS的内部电场、温度分布、临界散热路径和热阻,为其自热机制和热感知设计提供了深入的见解。此外,通过优化源极/漏极结深、环境温度和边界热阻来缓解SOI-ATG LDMOS的自热效应。此外,还比较了不同的沟槽介质,实现了SOI-ATG LDMOS的电热协同优化。
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Electro-thermal Investigation on SOI Accumulation Mode Tri-gate LDMOS
An electro-thermal co-optimization has been carried out on silicon-on-insulator (SOI) accumulation mode tri-gate (ATG) LDMOS by TCAD simulation. Internal electric field, temperature distribution, critical heat removal path and the thermal resistance of SOI-ATG LDMOS are investigated, providing deep insights into its self-heating mechanism and thermal-aware design. Besides, the junction depth of source/drain, ambient temperature and boundary thermal resistance are optimized to mitigate the self-heating effect (SHE) in SOI-ATG LDMOS. Furthermore, different trench dielectrics are also compared to achieve an electro-thermal co-optimization of SOI-ATG LDMOS.
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