GeSi纳米结构中传导机制的转变

C. Palade, A. Lepadatu, I. Stavarache, V. Teodorescu, M. Ciurea
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摘要

基于gesi的纳米结构显示出独特的性能,使其适合集成电路技术。增强其电子特性以提高器件性能是人们的强烈兴趣。为了获得GeSi纳米结构中电输运的基本知识,我们通过改变退火条件,研究了不同微观结构对GeSi纳米结构薄膜电行为的影响。采用共溅射的方法,在不同的温度下进行适当的退火,制备了具有等原子组成和不同结构的GeSi纳米结构薄膜。为了确定电学行为,我们执行并模拟了考虑薄膜结构的电流-温度I - T特性。我们发现电学行为随着薄膜结构的变化而变化,证明了导电机制的转变。在几乎结晶的薄膜中,由薄的非晶区隔开的小GeSi纳米晶体形成,低温下的I - T依赖是由于邻近纳米晶体之间的载流子的热激活隧道。相比之下,在完全结晶的薄膜中,具有较大的锗硅纳米晶并在纳米晶之间有晶界,其电学行为是典型的多晶行为。我们的发现有助于阐明GeSi纳米结构中发生的传导机制,并为基于这些材料的高性能电子器件提供了一条途径。
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Transition in conduction mechanism in GeSi nanostructures
GeSi-based nanostructures show unique properties which make them suitable for integrated circuit technology. The strong interest is to enhance their electronic properties in order to improve the device performance. In order to obtain fundamental knowledge on the electrical transport taking place in GeSi nanostructures we have investigated the effects of different microstructures on the electrical behavior of GeSi nanostructured films, by modifying the annealing conditions. We manufactured GeSi nanostructured films with equiatomic composition and different structures by co-sputtering followed by adequate annealing under different temperatures. For determining the electrical behavior we performed and modeled current-temperature I - T characteristics taking into account the films structures. We found that the electrical behavior changes with the film structure by evidencing a transition in conduction mechanism. In films that are almost crystallized, being formed of small GeSi nanocrystals separated by thin amorphous regions, the I - T dependence at low temperature is due to thermally activated tunneling of carriers between neighboring nanocrystals. In contrast, in the completely crystallized films with big GeSi nanocrystals and crystallized borders between them, the electrical behavior is a typical polycrystalline one. Our findings help to clarify the conduction mechanisms taking place in GeSi nanostructures and to provide a route to electronic devices with high performance based on these materials.
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