用田口法统计优化22 nm p型MOSFET阈值电压的工艺参数

A. H. Afifah Maheran, P. Menon, S. Shaari, I. Ahmad, Z. A. Noor Faizah
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引用次数: 1

摘要

采用田口L9正交阵列,研究了工艺参数变化对22 nm工艺的p型金属氧化物半导体场效应晶体管(MOSFET)器件的影响。该器件采用二氧化钛(TiO2)和硅化钨(WSix)金属栅极组成的高k/金属栅极,利用工业数值模拟器构建。利用Taguchi的名义最佳信噪比(NTB),确定补偿植入是影响Vth值的主导因素(67.77%),而Halo植入的倾斜角度是调节因素。优化后的Vth值为-0.29538 V,符合国际半导体技术路线图(ITRS) 2012的要求-0.289 V±12.7%。
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Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method
This paper aims to study the effect of process parameter variation on a nano-scaled planar p-type MOSFET (metal-oxide-semiconductor field-effect transistor) device for 22 nm technology using Taguchi's L9 orthogonal array. The device was constructed with high-k/metal gate consisting of Titanium dioxide (TiO2) and Tungsten silicide (WSix) metal gate using an industrial-based numerical simulator. Using Taguchi's Signal-to-noise ratio (SNR) of nominal-the-best (NTB), the compensation implantation has been as identified as the dominant factor influencing the Vth value with 67.77% while the Halo implantation tilting angle has been identified as the adjustment factor. Upon optimization, the Vth value is -0.29538 V which is within the requirements of the International Technology Roadmap for Semiconductors (ITRS) 2012 which is -0.289 V ± 12.7 %.
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