PSOI灯与LDMOSFET的横向超结

M. Antoniou, E. Tee, S. Pilkington, D. K. Pal, F. Udrea, A. Hoelke
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引用次数: 2

摘要

本文介绍了在0.18μm PSOI高压工艺中,超结light与部分绝缘体上硅(PSOI)技术中的LDMOSFET的比较。超结漂移区有助于在两种结构中实现均匀的电场分布,但也有助于在light中实现导通电流。该超结light成功实现了210V的击穿电压(BV), Rdson值为765mΩ.mm2。与采用相同技术的兼容横向超结LDMOS相比,在相同的BV下,它具有更低的比导通电阻Rdson和更高的饱和电流(Idsat)。
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The lateral superjunction PSOI LIGBT and LDMOSFET
This paper presents a comparison between the superjunction LIGBT and the LDMOSFET in partial silicon-on-insulator (PSOI) technology in 0.18μm PSOI HV process. The superjunction drift region helps in achieving uniform electric field distribution in both structures but also contributes to the on-state current in the LIGBT. The superjunction LIGBT successfully achieves breakdown voltage (BV) of 210V with Rdson of 765mΩ.mm2. It exhibits reduced specific on-state resistance Rdson and higher saturation current (Idsat) for the same BV compared to a compatible lateral superjunction LDMOS in the same technology.
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