{"title":"Sn3.0Ag0.5Cu/Sn58Bi结构复合焊料互连的电迁移行为","authors":"Fengjiang Wang, Lili Zhou, Xiaojing Wang","doi":"10.1109/ICEPT.2016.7583134","DOIUrl":null,"url":null,"abstract":"The microstructure and electromigration of Bi and Sn in Cu/Sn58Bi/Cu and Cu/Sn58Bi /Sn3.0Ag0.5Cu/ Sn58Bi/Cu structural composite solder joint, were researched under the current density of 1.0×104 A/cm2 at room temperature. Two kinds of solder joints changed their morphology at both anode sides and cathode sides after current stressing. Bi layer was formed in the anode side while Sn layer was formed in the cathode side. The microanalysis indicated that Bi was the major diffusion element from cathode to anode and the migration of atomic Bi was faster than atomic Sn. Furthermore, through the comparison of two kinds of solder joints, it was easy to find that Sn3.0Ag0.5Cu suppressed the migration of atomic Bi and atomic Sn during electromigration.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"10 1","pages":"268-272"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electromigration behavior of Sn3.0Ag0.5Cu/Sn58Bi structural composite solder interconnect\",\"authors\":\"Fengjiang Wang, Lili Zhou, Xiaojing Wang\",\"doi\":\"10.1109/ICEPT.2016.7583134\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The microstructure and electromigration of Bi and Sn in Cu/Sn58Bi/Cu and Cu/Sn58Bi /Sn3.0Ag0.5Cu/ Sn58Bi/Cu structural composite solder joint, were researched under the current density of 1.0×104 A/cm2 at room temperature. Two kinds of solder joints changed their morphology at both anode sides and cathode sides after current stressing. Bi layer was formed in the anode side while Sn layer was formed in the cathode side. The microanalysis indicated that Bi was the major diffusion element from cathode to anode and the migration of atomic Bi was faster than atomic Sn. Furthermore, through the comparison of two kinds of solder joints, it was easy to find that Sn3.0Ag0.5Cu suppressed the migration of atomic Bi and atomic Sn during electromigration.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"10 1\",\"pages\":\"268-272\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583134\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583134","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electromigration behavior of Sn3.0Ag0.5Cu/Sn58Bi structural composite solder interconnect
The microstructure and electromigration of Bi and Sn in Cu/Sn58Bi/Cu and Cu/Sn58Bi /Sn3.0Ag0.5Cu/ Sn58Bi/Cu structural composite solder joint, were researched under the current density of 1.0×104 A/cm2 at room temperature. Two kinds of solder joints changed their morphology at both anode sides and cathode sides after current stressing. Bi layer was formed in the anode side while Sn layer was formed in the cathode side. The microanalysis indicated that Bi was the major diffusion element from cathode to anode and the migration of atomic Bi was faster than atomic Sn. Furthermore, through the comparison of two kinds of solder joints, it was easy to find that Sn3.0Ag0.5Cu suppressed the migration of atomic Bi and atomic Sn during electromigration.
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