{"title":"用非晶Cu-Ti填充金属连接氧化铝与铜(材料、冶金及可焊性)","authors":"M. Naka, K. Asami, I. Okamoto","doi":"10.2207/QJJWS.4.321","DOIUrl":null,"url":null,"abstract":"Joining of alumina (99.62mass% Al2O3) to copper was made using amorphous Cu-Ti (34-57 at%) brazing filler metals at 1173 to 1323 K in 2.7•~10-3 Pa. The amorphous filler metals, 1 cm in width and 45 ,um thick, were produced by liquid quenching. The superior flexibility of amorphous filler provides simplicity to joining process. The fracture shear strength of the joints was measured at room temperature. The strength of the joints brazed at 1323 K for 1.8 ks using CusoTiso filler possesses 138.3 M Pa at room temperature. The strength of the joints at constant brazing time raises with an increase in brazing temperature. The strength increases slightly with an increase in titanium content in the filler. At 1298 K for 1.8 ks, the strength of joints at room temperature changes from 107.8 M Pa with Cu66Ti34 to 120.6 M Pa with Cu43Tis7. The strength of the joints was also investigated at high temperatures up to 973 K. The high temperature shear strength is almost constant up to 773 K, and deceases gradually at higher temperature. Isothermal solidification process takes place during joining, and copper dissoves into Cu-Ti filler metal, and then, copper solid solution containing Ti precipitates from Cu-Ti filler metal. On the other hand, the formation of titanium oxide TiO1 and (Al, Ti)2O3 solid solution oxide is attributable to the strong joining between alumina and Cu-Ti filler.","PeriodicalId":23197,"journal":{"name":"Transactions of JWRI","volume":"1 1","pages":"253-258"},"PeriodicalIF":0.0000,"publicationDate":"1986-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Joining of Alumina to Copper Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)\",\"authors\":\"M. Naka, K. Asami, I. Okamoto\",\"doi\":\"10.2207/QJJWS.4.321\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Joining of alumina (99.62mass% Al2O3) to copper was made using amorphous Cu-Ti (34-57 at%) brazing filler metals at 1173 to 1323 K in 2.7•~10-3 Pa. The amorphous filler metals, 1 cm in width and 45 ,um thick, were produced by liquid quenching. The superior flexibility of amorphous filler provides simplicity to joining process. The fracture shear strength of the joints was measured at room temperature. The strength of the joints brazed at 1323 K for 1.8 ks using CusoTiso filler possesses 138.3 M Pa at room temperature. The strength of the joints at constant brazing time raises with an increase in brazing temperature. The strength increases slightly with an increase in titanium content in the filler. At 1298 K for 1.8 ks, the strength of joints at room temperature changes from 107.8 M Pa with Cu66Ti34 to 120.6 M Pa with Cu43Tis7. The strength of the joints was also investigated at high temperatures up to 973 K. The high temperature shear strength is almost constant up to 773 K, and deceases gradually at higher temperature. Isothermal solidification process takes place during joining, and copper dissoves into Cu-Ti filler metal, and then, copper solid solution containing Ti precipitates from Cu-Ti filler metal. On the other hand, the formation of titanium oxide TiO1 and (Al, Ti)2O3 solid solution oxide is attributable to the strong joining between alumina and Cu-Ti filler.\",\"PeriodicalId\":23197,\"journal\":{\"name\":\"Transactions of JWRI\",\"volume\":\"1 1\",\"pages\":\"253-258\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1986-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of JWRI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2207/QJJWS.4.321\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of JWRI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2207/QJJWS.4.321","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
采用非晶Cu-Ti (34-57 at%)钎料,在2.7•~10- 3pa温度为1173 ~ 1323 K的条件下,将氧化铝(99.62质量% Al2O3)与铜钎焊。采用液相淬火法制备了宽度为1cm,厚度为45um的非晶态填充金属。非晶填料优越的柔韧性使其连接工艺简单。在室温下测试了接头的断裂抗剪强度。使用CusoTiso钎料在1323 K下钎焊1.8 K后,接头的室温强度为138.3 M Pa。在一定钎焊时间下,接头强度随钎焊温度的升高而升高。随着填料中钛含量的增加,强度略有增加。在1298 K热处理1.8 K时,接头的室温强度由Cu66Ti34 (107.8 M Pa)变为Cu43Tis7 (120.6 M Pa)。在973 K的高温下,还研究了接头的强度。高温抗剪强度在773 K以下基本保持不变,随着温度的升高而逐渐降低。在连接过程中发生等温凝固过程,铜溶解到Cu-Ti填充金属中,然后从Cu-Ti填充金属中析出含Ti的铜固溶体。另一方面,氧化钛TiO1和(Al, Ti)2O3固溶体氧化物的形成是由于氧化铝与Cu-Ti填料之间的强结合。
Joining of Alumina to Copper Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)
Joining of alumina (99.62mass% Al2O3) to copper was made using amorphous Cu-Ti (34-57 at%) brazing filler metals at 1173 to 1323 K in 2.7•~10-3 Pa. The amorphous filler metals, 1 cm in width and 45 ,um thick, were produced by liquid quenching. The superior flexibility of amorphous filler provides simplicity to joining process. The fracture shear strength of the joints was measured at room temperature. The strength of the joints brazed at 1323 K for 1.8 ks using CusoTiso filler possesses 138.3 M Pa at room temperature. The strength of the joints at constant brazing time raises with an increase in brazing temperature. The strength increases slightly with an increase in titanium content in the filler. At 1298 K for 1.8 ks, the strength of joints at room temperature changes from 107.8 M Pa with Cu66Ti34 to 120.6 M Pa with Cu43Tis7. The strength of the joints was also investigated at high temperatures up to 973 K. The high temperature shear strength is almost constant up to 773 K, and deceases gradually at higher temperature. Isothermal solidification process takes place during joining, and copper dissoves into Cu-Ti filler metal, and then, copper solid solution containing Ti precipitates from Cu-Ti filler metal. On the other hand, the formation of titanium oxide TiO1 and (Al, Ti)2O3 solid solution oxide is attributable to the strong joining between alumina and Cu-Ti filler.