用应变计测量SAC305焊点在不同热循环条件下的实验应变能密度

J. Libot, F. Dulondel, P. Milesi, J. Alexis, L. Arnaud, O. Dalverny
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引用次数: 5

摘要

尽管在过去的二十年中进行了广泛的研究,但对于希望从铅基(SnPb)转向无铅电子产品的行业来说,焊点的热机械耐久性评估仍然是一个主要问题。在各种无铅焊料成分中,96.5Sn-3.0Ag-0.5Cu (SAC305)钎料合金已成为经典SnPb钎料的首选替代品。然而,与SnPb组件不同,经验回报有限,SAC305焊点的微观结构也非常不同。使用SAC305焊膏需要了解焊接互连的机械和疲劳行为。本文介绍了基于应变片测量的实验,可以确定SAC305焊点在不同热循环条件下的剪切应力-应变响应。实验剪切应变-应力滞回线的面积给出了对应于每种热机械载荷的应变能密度值。试验装置的有限元模拟表明,试验应变能密度与数值应变能密度具有良好的相关性。实验得到的剪切应变-应力曲线也为SAC305焊点本构规律的推导提供了必要的数据。
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Experimental Strain Energy Density Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages Measurements
Despite being widely investigated for the last two decades, solder joints thermomechanical durability assessment remains a major concern for industries wishing to switch from lead-based (SnPb) to lead-free electronics. Amongst the variety of lead-free solder compositions, 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloy has become the preferred substitute to classic SnPb solders. However, unlike SnPb assemblies, the return on experience is limited and the microstructure is very different for SAC305 solder joints. The use of SAC305 solder paste requires to understand the mechanical and fatigue behaviors of the soldered interconnects. This paper presents the experimentation based on strain gages measurements, allowing the determination of the shear stress-strain response of SAC305 solder joints subjected to different thermal cycling conditions. The area of the experimental shear strain-stress hysteresis loops gives the values of the strain energy density corresponding to each thermomechanical loading. The finite element modeling of the test assembly showed a good correlation between experimental and numerical strain energy densities. The experimental shear strain-stress curves also provide the necessary data to derive SAC305 solder joints constitutive laws.
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