半透明钙钛矿微型模块互连方案评价

2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) Pub Date : 2019-06-16 DOI:10.1109/PVSC40753.2019.9198965

Colin D. Bailie, C. Eberspacher, Timothy S. Gehan, R. Bramante, M. Van Hest

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引用次数: 0

摘要

这项工作评估了半透明钙钛矿模块集成中围绕P1、P2和P3刻划的关键问题。我们发现P1的誊写程序很好地从其他薄膜技术中翻译过来。P2划痕最好使用机械划痕，但仍然是串联电阻的来源。发现P3划痕造成划痕死区增加，是潜在的劣化源。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Evaluating Interconnection Schemes for Semi-transparent Perovskite Mini-modules

This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.

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2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

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