考虑工艺变化的软误差影响建模

Chong Zhao, S. Dey
{"title":"考虑工艺变化的软误差影响建模","authors":"Chong Zhao, S. Dey","doi":"10.1109/ICCD.2007.4601927","DOIUrl":null,"url":null,"abstract":"This paper addresses the aggregated effects of two types of variations that contribute to the reliability degradation. The first one is the increasing level of process variation; the second one is one particular type of environmental variation - the radiation-induced soft error. Their simultaneous presence can cause large negative performance impact. We present a statistical approach to model the generation and propagation of a transient soft error inside combinational circuits considering the existence of inter-die channel length variation in CMOS digital circuits. Experiment results have demonstrated that channel length variation can significantly aggravate the soft error effect, which can be accurately evaluated using the proposed methodology.","PeriodicalId":6306,"journal":{"name":"2007 25th International Conference on Computer Design","volume":"122 1","pages":"376-381"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Modeling soft error effects considering process variations\",\"authors\":\"Chong Zhao, S. Dey\",\"doi\":\"10.1109/ICCD.2007.4601927\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper addresses the aggregated effects of two types of variations that contribute to the reliability degradation. The first one is the increasing level of process variation; the second one is one particular type of environmental variation - the radiation-induced soft error. Their simultaneous presence can cause large negative performance impact. We present a statistical approach to model the generation and propagation of a transient soft error inside combinational circuits considering the existence of inter-die channel length variation in CMOS digital circuits. Experiment results have demonstrated that channel length variation can significantly aggravate the soft error effect, which can be accurately evaluated using the proposed methodology.\",\"PeriodicalId\":6306,\"journal\":{\"name\":\"2007 25th International Conference on Computer Design\",\"volume\":\"122 1\",\"pages\":\"376-381\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 25th International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2007.4601927\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 25th International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2007.4601927","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

本文讨论了导致可靠性退化的两类变量的综合效应。第一个是工艺变化水平的增加;第二种是一种特殊类型的环境变化——辐射引起的软误差。它们同时存在可能会对性能造成很大的负面影响。考虑到CMOS数字电路中存在的芯片间通道长度变化,我们提出了一种统计方法来模拟组合电路中瞬态软误差的产生和传播。实验结果表明,信道长度的变化会显著加剧软误差效应,使用该方法可以准确地评估软误差效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Modeling soft error effects considering process variations
This paper addresses the aggregated effects of two types of variations that contribute to the reliability degradation. The first one is the increasing level of process variation; the second one is one particular type of environmental variation - the radiation-induced soft error. Their simultaneous presence can cause large negative performance impact. We present a statistical approach to model the generation and propagation of a transient soft error inside combinational circuits considering the existence of inter-die channel length variation in CMOS digital circuits. Experiment results have demonstrated that channel length variation can significantly aggravate the soft error effect, which can be accurately evaluated using the proposed methodology.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Compiler-assisted architectural support for program code integrity monitoring in application-specific instruction set processors Improving the reliability of on-chip data caches under process variations Analytical thermal placement for VLSI lifetime improvement and minimum performance variation Why we need statistical static timing analysis Voltage drop reduction for on-chip power delivery considering leakage current variations
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1