基于局域顺磁模型的热膨胀理论

R. Konno, N. Hatayama, Y. Takahashi
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摘要

许多研究者对铀化合物的物理性质进行了理论研究[1,2]和实验研究[3]。Moriya, Kawabata和Takahashi发展了自旋涨落的自洽重整化理论(SCR理论),该理论考虑了自洽随机相位近似之外的自旋涨落的模-模耦合[1]。U化合物中U离子的5f电子比过渡金属化合物中的3d电子更局域化,而比Ce化合物中的4f电子局域化更小。作为第一个起点,我们使用了SCR理论中的局域顺磁模型,其中自旋涨落的阻尼常数与波数无关。Konno和Moriya基于定域顺磁模型研究了铀化合物的比热[2]。该模型在UPt3和UAl2中有效。他们的理论定性地解释了比热实验数据。虽然有实验报道短距离反铁磁相关很重要[3],但局域顺磁子模型可以同时考虑近铁磁和近反铁磁金属,因为阻尼常数与波数无关。我们认为铀化合物的热膨胀在理论上还没有被理解。我们研究了基于局域顺磁子模型的热膨胀。采用Takahashi的方法[1]得到热膨胀。讨论了比热的行为是否与热膨胀系数的行为一致。这篇论文很有条理。下一节将提供公式。在第3节中,将显示数值结果。最后一节将给出结论。
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Theory of thermal expansion based on the localized paramagnon model
Many researchers have studied physical properties of U compounds theoretically [1, 2] and experimentally [3]. Moriya, Kawabata, and Takahashi developed the self-consistent renormalization theory of spin fluctuations (the SCR theory) that takes into account mode-mode couplings of spin fluctuations beyond the random phase approximation self-consistently [1]. 5f electrons of U ions in U compounds are more localized than 3d electrons of transition metal compounds and less localized than 4f electrons of Ce compounds. As the first starting point, we use the localized paramagnon model in the SCR theory where the damping constant of spin fluctuations is independent of wave numbers. Konno and Moriya examined specific heats of U compounds based on the localized paramagnon model [2]. This model is valid in UPt3 and UAl2. Their theory explained the specific heat experimental data qualitatively. Although it was experimentally reported that the short range antiferromagnetic correlation was important [3], the localized paramagnon model can consider both the nearly ferromagnetic and nearly antiferromagnetic metals because the damping constant is independent of wave numbers. We feel that thermal expansion in U compounds has not been understood theoretically. We investigate thermal expansion based on the localized paramagnon model. By using Takahashi’s method [1] thermal expansion is obtained. Whether the behavior of the specific heat is consistent with that of the thermal expansion coefficient is discussed. This paper is organized. In the next section the formulation will be provided. In section 3 the numerical results will be shown. In the last section the conclusion will be provided.
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