先进半导体器件用氧化硅和高k介电体的隧穿漏电流特性

F. Babarada, R. Plugaru, A. Rusu
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引用次数: 0

摘要

连续尺度的降低使得场效应晶体管的器件和结构具有高掺杂漏源和薄绝缘层的特点。当层的厚度小于等于2nm时,半导体通道和栅极之间的耦合可以忽略不计。一个正确的量子力学模型必须正确地评估通道电荷分布和通过隧穿作用在栅极和通道之间流动的漏电流。所提出的一维器件主要电参数的迭代近似计算方法计算时间短,并应用于硅器件中薄氧化硅和高k介电材料堆叠组合的研究。
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Tunelling leakage current characterization of silicon oxide and high-k dielectics for advanced semiconductor devices
The continuum down-scaling lead the field-effect transistors in the nanometre region with devices and structures characterized by high doping drains/ sources and thin insulating layers. When the thickness of the layers attends 2 nm or less, the coupling between the semiconductor channel and the gate canpsilat be neglected. A correct quantum-mechanical model must correct evaluate the channel charge distribution and the leakage current flowing between the gate and the channel through tunnelling. The presented iterative approximation method for calculate the 1D device main electric parameters offer short time computation and was applied to study the thin silicon oxide and high-k dielectrics stacks combination for the silicon devices.
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