高压MOS晶体管I-V特性与总电离剂量效应的关系

A. Nagornov, V. Timoshenkov
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摘要

本文对总电离剂量(TID)对高压MOS晶体管I-V特性的影响进行了理论和实验研究。采用两种不同的双极- cmos - dmos (BCD)工艺制造MOS晶体管。高压MOS用于承受强辐射的电源管理ic。因此,设备接受了各种TID水平的辐射,最高可达105克拉。所得结果允许修改晶体管的SPICE模型,以考虑其特性的变化。因此,可以评估TID对电源管理IC功能特性的影响,并在未来提高其可靠性。研究结果表明,BCD 0.5 um的耐辐射性能优于BCD 1 um,但BCD 1 um的击穿电压高于BCD 0.5 um。
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Dependence of HV MOS transistor I-V characteristics from total ionizing dose effects
Theoretical and experimental research of total ionizing dose (TID) effects on high voltage (HV) MOS transistor I-V characteristics are presented. MOS transistors, manufactured in 2 different Bipolar-CMOS-DMOS (BCD) technological processes, were used in the research. HV MOS are used for power management ICs undergoing harsh radiation. Thus, devices underwent radiation to various TID levels up to 105 krad. The obtained results allowed to modify the SPICE models of transistors taking into account the changes of their characteristics. As the result, it will be possible to evaluate the effects of TID on power management IC's functional characteristics and increase their reliability in future. The results of the study show that BCD 0,5 um has better radiation resistance than BCD 1 um, but breakdown voltage of BCD 1 um is higher than that of BCD 0,5 um.
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