Zhiqiang Nie, Yao Lu, Dihai Wu, Shuna Wang, Pu Zhang, Lingling Xiong, Xiaoning Li, Zenan Shen, Dihai Wu
{"title":"808nm大功率二极管激光阵列连续波模式热加速老化试验","authors":"Zhiqiang Nie, Yao Lu, Dihai Wu, Shuna Wang, Pu Zhang, Lingling Xiong, Xiaoning Li, Zenan Shen, Dihai Wu","doi":"10.1109/ICEPT.2016.7583100","DOIUrl":null,"url":null,"abstract":"The reliability is the important performance of high power semiconductor laser. Thermally accelerated ageing test is an important technology of lifetime evaluation and reliability analysis. In this study, three groups of thermally accelerated ageing tests of conduction-cooled-packaged 60W 808nm high power diode laser arrays packaged by Indium solder at constant current have been carried out. Analysis of ageing data suggest the extrapolated lifetime under room temperature to value device reliability. We also analyze and discuss the degradation modes. This work can provide guidance for optimizing the chip and package structure, is helpful for improving performance and enhancing reliability of high power semiconductor lasers.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"50 1","pages":"111-115"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode\",\"authors\":\"Zhiqiang Nie, Yao Lu, Dihai Wu, Shuna Wang, Pu Zhang, Lingling Xiong, Xiaoning Li, Zenan Shen, Dihai Wu\",\"doi\":\"10.1109/ICEPT.2016.7583100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The reliability is the important performance of high power semiconductor laser. Thermally accelerated ageing test is an important technology of lifetime evaluation and reliability analysis. In this study, three groups of thermally accelerated ageing tests of conduction-cooled-packaged 60W 808nm high power diode laser arrays packaged by Indium solder at constant current have been carried out. Analysis of ageing data suggest the extrapolated lifetime under room temperature to value device reliability. We also analyze and discuss the degradation modes. This work can provide guidance for optimizing the chip and package structure, is helpful for improving performance and enhancing reliability of high power semiconductor lasers.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"50 1\",\"pages\":\"111-115\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583100\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode
The reliability is the important performance of high power semiconductor laser. Thermally accelerated ageing test is an important technology of lifetime evaluation and reliability analysis. In this study, three groups of thermally accelerated ageing tests of conduction-cooled-packaged 60W 808nm high power diode laser arrays packaged by Indium solder at constant current have been carried out. Analysis of ageing data suggest the extrapolated lifetime under room temperature to value device reliability. We also analyze and discuss the degradation modes. This work can provide guidance for optimizing the chip and package structure, is helpful for improving performance and enhancing reliability of high power semiconductor lasers.
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