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引用次数: 2

摘要

特征尺寸小于100纳米的硅和硅锗晶体管已经证明可以在亚太赫兹和太赫兹频率范围内工作,在通信、5g以上WI - FI、传感和成像方面具有潜在的应用前景。深亚微米器件中弹道电子输运的新特征必须考虑到在亚太赫兹和太赫兹频率下工作的Si和SiGe晶体管的设计、建模和表征。关键问题是电子惯性和电子粘度在超短尺寸下决定等离子体波的频率和衰减的关键作用-晶体管通道电子(或空穴)流体中的电子密度振荡。本文将对Si和SiGe太赫兹电子器件的最新技术进行回顾,并将重点放在作为太赫兹和亚太赫兹应用的主要竞争对手的Si等离子体器件上。
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Silicon and Silicon Germanium Terahertz Electronics
Silicon and silicon germanium transistors with feature sizes below 100 nm have demonstrated operation in sub-terahertz and terahertz frequency ranges with potential applications in communications, Beyond 5 G WI FI, sensing, and imaging. New features of ballistic electron transport in deep submicron devices must be accounted for design, modeling, and characterization of Si and SiGe transistors operating at sub-THz and THz frequencies. The key issue is the crucial role that the electron inertia and electron viscosity play at ultra-short sizes determining the frequency and decay of the plasma waves - the electron density oscillations in the transistor channel electronic (or hole) fluid. This paper will present a review of the state-of-the art of the Si and SiGe THz electronics and will focus on Si plasmonic devices emerging as key competitors for THz and sub-THz applications.
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