{"title":"基于Clech算法的IGBT焊点可靠性预测","authors":"Hua Lu, C. Bailey","doi":"10.1109/ICEPT.2016.7583309","DOIUrl":null,"url":null,"abstract":"The Clech Algorithm is an approximate method for the prediction of the stress state and damage of solder joints of electronics components such as Flipchip, Ball Grid Array that are undergone time dependent temperature load. It can be used to predict the reliability of solder joint under temperature cycling conditions. In this work, the application of this algorithm has been described and applied to predict the stress/strain and plastic work density in IGBT solder joints. The results are compared with 2D Finite Element analysis and it is concluded that the Clech Algorithm can be used for reliability prediction of IGBT solder joint.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"63 1","pages":"1059-1063"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Reliability prediction for IGBT solder joints using Clech Algorithm\",\"authors\":\"Hua Lu, C. Bailey\",\"doi\":\"10.1109/ICEPT.2016.7583309\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Clech Algorithm is an approximate method for the prediction of the stress state and damage of solder joints of electronics components such as Flipchip, Ball Grid Array that are undergone time dependent temperature load. It can be used to predict the reliability of solder joint under temperature cycling conditions. In this work, the application of this algorithm has been described and applied to predict the stress/strain and plastic work density in IGBT solder joints. The results are compared with 2D Finite Element analysis and it is concluded that the Clech Algorithm can be used for reliability prediction of IGBT solder joint.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"63 1\",\"pages\":\"1059-1063\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583309\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583309","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability prediction for IGBT solder joints using Clech Algorithm
The Clech Algorithm is an approximate method for the prediction of the stress state and damage of solder joints of electronics components such as Flipchip, Ball Grid Array that are undergone time dependent temperature load. It can be used to predict the reliability of solder joint under temperature cycling conditions. In this work, the application of this algorithm has been described and applied to predict the stress/strain and plastic work density in IGBT solder joints. The results are compared with 2D Finite Element analysis and it is concluded that the Clech Algorithm can be used for reliability prediction of IGBT solder joint.
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