焊料凸点电迁移失效的紧凑模型

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI:10.1109/IITC-MAM.2015.7325651

H. Ceric, S. Selberherr

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引用次数: 0

摘要

焊点的机械和电气性能影响着3D集成电路的整体可靠性。在本文中，我们提出了一个紧凑的模型来预测在电迁移影响下焊料凸点的平均失效时间。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Compact model for solder bump electromigration failure

The mechanical and electrical properties of solder bumps influence the overall reliability of 3D ICs. In this paper we present a compact model for prediction of the mean-time-to-failure of solder bumps under the influence of electromigration.

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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

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