{"title":"一种减少三维集成电路堆叠测试时间的测试存取机制","authors":"Inhyuk Choi, Hyunggoy Oh, Sungho Kang","doi":"10.1109/APCCAS.2016.7804019","DOIUrl":null,"url":null,"abstract":"In this paper, the reconfigurable test access mechanism (RTAM) is designed based on the emerging test standard to reduce the cumulative stack test time of the 3-dimensional integrated circuit (3-D IC). The RTAM enables the test scheduling to reflect the variation of the test constraints in the overall stack test phases. Simulation results show the RTAM achieves the cumulative stack test time reduction compared with a non-reconfigurable TAM for the stacked dies in the 3-D IC.","PeriodicalId":6495,"journal":{"name":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Test access mechaism for stack test time reduction of 3-dimensional integrated circuit\",\"authors\":\"Inhyuk Choi, Hyunggoy Oh, Sungho Kang\",\"doi\":\"10.1109/APCCAS.2016.7804019\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the reconfigurable test access mechanism (RTAM) is designed based on the emerging test standard to reduce the cumulative stack test time of the 3-dimensional integrated circuit (3-D IC). The RTAM enables the test scheduling to reflect the variation of the test constraints in the overall stack test phases. Simulation results show the RTAM achieves the cumulative stack test time reduction compared with a non-reconfigurable TAM for the stacked dies in the 3-D IC.\",\"PeriodicalId\":6495,\"journal\":{\"name\":\"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APCCAS.2016.7804019\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCCAS.2016.7804019","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Test access mechaism for stack test time reduction of 3-dimensional integrated circuit
In this paper, the reconfigurable test access mechanism (RTAM) is designed based on the emerging test standard to reduce the cumulative stack test time of the 3-dimensional integrated circuit (3-D IC). The RTAM enables the test scheduling to reflect the variation of the test constraints in the overall stack test phases. Simulation results show the RTAM achieves the cumulative stack test time reduction compared with a non-reconfigurable TAM for the stacked dies in the 3-D IC.