{"title":"稳压电路的失效分析","authors":"Chuan Luo, Yongda Hu, S. Bao, Yongqiang Cui","doi":"10.1109/ICEPT.2016.7583159","DOIUrl":null,"url":null,"abstract":"In order to finding the reason why there is no output signal when the voltage signals inputted during the voltage stabilizing circuit module works, Scanning electron microscope and energy disperse spectroscopy were used to detecting the surface morphology and the internal composition. The analysis results show that it is the cold solder in the wire bonding caused by the inappropriate mounting depression that lead to the failure of this product, besides, Solder balls can be easily found in this circuit, Which would potential threat to it's stability. we could decrease the amount of the solder ball from the quality of solder and the condition of reflow.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"29 1","pages":"384-386"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"One failure analysis of voltage stabilizing circuit\",\"authors\":\"Chuan Luo, Yongda Hu, S. Bao, Yongqiang Cui\",\"doi\":\"10.1109/ICEPT.2016.7583159\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to finding the reason why there is no output signal when the voltage signals inputted during the voltage stabilizing circuit module works, Scanning electron microscope and energy disperse spectroscopy were used to detecting the surface morphology and the internal composition. The analysis results show that it is the cold solder in the wire bonding caused by the inappropriate mounting depression that lead to the failure of this product, besides, Solder balls can be easily found in this circuit, Which would potential threat to it's stability. we could decrease the amount of the solder ball from the quality of solder and the condition of reflow.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"29 1\",\"pages\":\"384-386\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583159\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
One failure analysis of voltage stabilizing circuit
In order to finding the reason why there is no output signal when the voltage signals inputted during the voltage stabilizing circuit module works, Scanning electron microscope and energy disperse spectroscopy were used to detecting the surface morphology and the internal composition. The analysis results show that it is the cold solder in the wire bonding caused by the inappropriate mounting depression that lead to the failure of this product, besides, Solder balls can be easily found in this circuit, Which would potential threat to it's stability. we could decrease the amount of the solder ball from the quality of solder and the condition of reflow.
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